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DDR3 Main Memory Interposers

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Double-data rate Third-generation (DDR3) main memory technologies are developed by the Joint Electronic Devices Engineering Council (JEDEC) for use in servers, workstations, and high-performance portable applications that require deep memory.Nexus Technology offers high quality and high fidelity interposers, enabling the industry to confidently and accurately gain access to DDR3 main memory buses for debug and compliance verification. …

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DDR3 Main Memory Interposers

類別：

DDR3 interposer
品牌：

NEXUS

Nexus Technology offers high quality and high fidelity interposers, enabling the industry to confidently and accurately gain access to DDR3 main memory buses for debug and compliance verification. …

Packaging/Modules

DDR3 main memory is available in standard Ball-Grid-Array (BGA) component packages as well as dual-inline-memory-modules of DIMM and SODIMM. Standard BGA packages are soldered directly to the printed circuit board (PCB) while modules comprise a series of packages in a standard PCB format with standard connections between the DIMM and the main board. Interposers are available for both component packages and DIMM and SODIMM modules.

DIMM Interposers

	Interposers
	Logic Compliance		MSO
Module Type	CMD	CMD/DATA	CMD/DATA
240 Pin DIMM	?	?	?
240 Pin DIMM	*	?	*
204 Pin SODIMM	?	?	?
204 Pin 72 Bit SODIMM	*	?	*
244 Pin MINIDIMM	*	?	*

Component Interposers

	Interposers				Options
	Oscilloscope			MA Instrument	Options
Package	EdgeProbe™	Direct Attach	Socketed	Socketed	Riser	Component Socket
78 Ball x4/x8	?	?	?	?	Yes	Yes
96 Ball x16	?	?	?	?	Yes	Yes
Custom	Custom designs are also available. Please contact us.

*If you don’t see what you need, please contact us for the most up to date information.

Attachment Service

Nexus Technology’s expert attachment service provides a ready-to-go test solution customized to your application. We will attach the interposer and any additional accessories to your application’s target. We can also power-on and test your application to confirm functionality.

Electrical Analysis

Electrical analysis is enabled by using either an EdgeProbe, High Density, or Socketed interposer to capture memory activity on an oscilloscope. The oscilloscope is then used to debug, analyze, and verify the analog characteristics of your design. Presenting an accurate representation of the signals under test to the oscilloscope is critical. Nexus interposers provide an unobtrusive interconnect and accurate signal to your oscilloscope.

Logic / Compliance Analysis

Logic analysis is performed using a logic / compliance interposer to capture memory activity on a logic or memory analyzer. The logic or memory analyzer is then used to debug, analyze, and verify the logic (basic protocol) of your design. Compliance analysis uses the same interposers to capture activity on a memory analyzer. The memory analyzer is then used to debug, analyze, margin test, performance analyze, and verify the memory protocol.